iTOP Final Electro-mechanical Packaging Task Force

Material Package

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SMTWTFS

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Contributions*

Adjourn (contingency)

Assembly, inspection, commissioning and debug: Discussion, Summary and Action Plan

Calibration: Discussion, Summary and Action Plan

Carrier card layout/configuration (SCROD, Interconnect, 4x Carriers)

Electrical calibration (sine, delayed PMT-like, BPM inj signal)

HV bypassing, coupling to PMTs

HV generation, cabling, mechanics and cooling

HV issues Discussion, Summary and Action Plan

Initial assembly, inspection, commissioning & debug plans

Integrated cooling/thermal management

Introductions / coffee/tea / Structure of this Task Force meeting

Mechanical coupling/interconnect of SCROD, Interconnect, Carriers & HV

Mechatronics Final Packaging: Discussion, Summary and Action Plan

Morning PID meeting

Optical calibration (including fiber routing, signal coupling)

Photonics Discussion, Summary and Action Plan

PMT electrical coupling (pins/sockets?)

PMT signal output routing to IRS3B (incl. cal inj. ckt)

PMT+filter mechanical support/alignment

PMT+filter optical coupling

Realistic Access Scenarios: Discussion, Summary and Action Plan

Realistic scenarios for electronics and optical access

Specifications/Constraints, missing Specifications

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Events scheduled on*

3/20/13

3/21/13

3/22/13

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